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Journal paper
Date of publication2001-11-00
Journal levelSCI
Paper title (chapter)Electrical Performance Improvements on RFICs Using Bump Chip Carrier Packages as Compared to Standard Thin Shrink Small Outline Packages
Name of journalIEEE TRANSACTIONS ON ADVANCED PACKAGING
number of chapters24
Issue No.4
起頁548
迄頁554
Total number of pages7
Name of author (Chinese)Song-Mao Wu
Name of author (English)Song-Mao Wu
AuthorsTzyy-Sheng Horng, Sung-Mao Wu, Chi-Tsung Chiu, and Chih-Pin Hung
Number of authors4
Author's typeCorresponding Author
Language usedEnglish

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