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Journal paper
Date of publication2010-10-00
Journal levelSCI
Paper title (chapter)Relationship between wafer fracture reduction and controlling during the edge manufacturing process
Name of journalMicroelectronic Engineering
number of chapters87
Issue No.10
起頁1809
迄頁1815
Name of author (Chinese)Wen-Kuan Yeh
Name of author (English)Wen-Kuan Yeh
AuthorsPo-Ying Chen, Ming-Hsing Tsai, Wen-Kuan Yeh, Ming-Haw Jing, and Yukon Chang
Number of authors5
Author's typeOther
Language usedEnglish

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