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Journal paper
Date of publication2007-11-00
Journal levelSCI / 其他
Paper title (chapter)Modeling Noise Coupling Between Package and PCB Power/Ground Planes With an Efficient 2-D FDTD/Lumped element Method
Name of journalIEEE Tran. On Advanced Packaging
number of chaptersvol.30
Issue No.no.4
起頁1
迄頁8
Total number of pages8
Name of author (Chinese)Song-Mao Wu
Name of author (English)Song-Mao Wu
AuthorsTing-Kuang Wang, Sin-Ting Chen, Chi-Wei Tsai, Sung-Mao Wu, James L. Drewniak, and Tzong-Lin Wu
Number of authors6
Author's typeCorresponding Author
Language usedEnglish

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