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Seminar paper
Year2007
Paper type其他
Paper level其他
Paper title (chapter)Efficient Modeling of Packaging for Silicon-Base Inductor and MIM Capacitor
Name of conferenceISSSE
Name of author (Chinese)Wen-Kuan Yeh
Name of author (English)Wen-Kuan Yeh
AuthorsChia-Wei Hsu*, Sung-Mao Wu, Wen-Kuan Yeh, and Mark Li
Number of authors4
Author's typeCorresponding Author
LocationQubec, Canada
Language usedEnglish

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