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Seminar paper
Year2006
Paper type其他
Paper level其他
Paper title (chapter)Impacts of Layout Dimensions and Ambient Temperatures on Silicon Based On-Chip RF Interconnects
Name of conferenceSolid-State Device and Materials
Conference starting time2006-09-00
Conference closing time2006-09-00
Name of author (Chinese)Wen-Kuan Yeh
Name of author (English)Wen-Kuan Yeh
AuthorsM. C. Tang, Y. K. Fang, W. K. Yeh and R. L. Wang
Number of authors4
Author's typeCorresponding Author
LocationYoKohama, Japan
Language usedEnglish

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