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Seminar paper
Year2006
Paper type其他
Paper level其他
Paper title (chapter)The Reliability Characteristics of Wafer-Level Chip Scale Package under Various Current stressing
Name of conferenceSolid-State Device and Materials
Name of author (Chinese)Wen-Kuan Yeh
Name of author (English)Wen-Kuan Yeh
AuthorsH. Y. Kung, S. H. Chen, Y. S. Lai, E. Jahja, and W. K. Yeh
Number of authors5
Author's typeCorresponding Author
LocationYoKohama, Japan
Language usedEnglish

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