:::
Seminar paper
Year2006
Paper type其他
Paper level其他
Paper title (chapter)The Reliability Characteristics of Wafer-Level Chip Scale Package under Various Current stressing
Name of conferenceSolid-State Device and Materials
Name of author (Chinese)Wen-Kuan Yeh
Name of author (English)Wen-Kuan Yeh
AuthorsH. Y. Kung, S. H. Chen, Y. S. Lai, E. Jahja, and W. K. Yeh
Number of authors5
Author's typeCorresponding Author
LocationYoKohama, Japan
Language usedEnglish

Calendar

« May 2019»
Mon.Tue.Wed.Thu.Fri.Sat.Sun.
  0102030405
06070809101112
13141516171819
20212223242526
2728293031
Decorative image

Decorative image

Decorative image

Gallery

Decorative imageDecorative imageDecorative imageDecorative imageDecorative imageDecorative imageDecorative imageDecorative imageDecorative imageDecorative imageDecorative imageDecorative image
Read more
cron web_use_log