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Seminar paper
Year2010
Paper type口頭報告
Paper title (chapter)The Study Of Delaminating At Interface Between Molding Compound And Gold Substrate Bond Pad In BGA(Ball Grid Array) Package
Name of conferenceIMPACT 2010 International Microsystems, Packaging, Assembly and Circuits Technology conference
Conference starting time2010-10-20
Conference closing time2010-10-22
Name of author (Chinese)Ming-Chang Shih
Name of author (English)Ming-Chang Shih
AuthorsMing Chang Shih and Chin Chun Hsieh
Number of authors2
Author's typeCorresponding Author
LocationTaipei
Language usedEnglish

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