:::
Seminar paper
Year2011
Paper type會議論文
Paper title (chapter)Novel Substrate Design Kit with Power Delivery System Resonant for RF Package Signal Integrity
Name of conferenceInternational Conference on Electronics Packaging
Conference starting time2011-04-18
Conference closing time2011-04-20
Name of author (Chinese)Song-Mao Wu
Name of author (English)Song-Mao Wu
AuthorsMeng-Hsum Li(李孟勳), Chun-Ting Kuo(郭俊廷), Kao-Yi Wang(王高義), Sung-Mao Wu
Number of authors4
Author's typeCorresponding Author
LocationJapan Tokyo
Language usedEnglish

Calendar

« April 2019»
Mon.Tue.Wed.Thu.Fri.Sat.Sun.
01020304050607
08091011121314
15161718192021
22232425262728
2930
Decorative image

Decorative image

Decorative image

Gallery

Decorative imageDecorative imageDecorative imageDecorative imageDecorative imageDecorative imageDecorative imageDecorative imageDecorative imageDecorative imageDecorative imageDecorative image
Read more
cron web_use_log