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Seminar paper
Year2011
Paper type會議論文
Paper title (chapter)Novel Substrate Design Kit with Power Delivery System Resonant for RF Package Signal Integrity
Name of conferenceInternational Conference on Electronics Packaging
Conference starting time2011-04-18
Conference closing time2011-04-20
Name of author (Chinese)Song-Mao Wu
Name of author (English)Song-Mao Wu
AuthorsMeng-Hsum Li(李孟勳), Chun-Ting Kuo(郭俊廷), Kao-Yi Wang(王高義), Sung-Mao Wu
Number of authors4
Author's typeCorresponding Author
LocationJapan Tokyo
Language usedEnglish

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