:::
Seminar paper
Year2010
Paper type會議論文
Paper title (chapter)Property of impedance matching of novel QFP socket contactor by 3D electro-magnetic simulation
Name of conferenceElectronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010
Conference starting time2010-08-00
Conference closing time2010-08-00
Name of author (Chinese)Song-Mao Wu
Name of author (English)Song-Mao Wu
AuthorsW. Sung-Mao, G. Sheng-Wei(官聖洧), K. Chun-Ting, Y. Bo-Huei(余柏輝), L. Chuan-Hau, and C. Xian-Neng
Number of authors6
Author's typeFirst Author
Location西安
Language usedEnglish

Calendar

« April 2019»
Mon.Tue.Wed.Thu.Fri.Sat.Sun.
01020304050607
08091011121314
15161718192021
22232425262728
2930
Decorative image

Decorative image

Decorative image

Gallery

Decorative imageDecorative imageDecorative imageDecorative imageDecorative imageDecorative imageDecorative imageDecorative imageDecorative imageDecorative imageDecorative imageDecorative image
Read more
cron web_use_log