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Seminar paper
Year2010
Paper type會議論文
Paper title (chapter)Property of impedance matching of novel QFP socket contactor by 3D electro-magnetic simulation
Name of conferenceElectronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010
Conference starting time2010-08-00
Conference closing time2010-08-00
Name of author (Chinese)Song-Mao Wu
Name of author (English)Song-Mao Wu
AuthorsW. Sung-Mao, G. Sheng-Wei(官聖洧), K. Chun-Ting, Y. Bo-Huei(余柏輝), L. Chuan-Hau, and C. Xian-Neng
Number of authors6
Author's typeFirst Author
Location西安
Language usedEnglish

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