:::
Year | 2012 |
---|---|
Paper type | 會議論文 |
Paper level | 其他 |
Paper title (chapter) | Manufacture of Novel Double-Side Direct Thru Kit with Non-exchange Layer Structure Base on General PCB Process |
Name of conference | Asia-Pacific Microwave Conference 2012 (APMC2012) |
Conference starting time | 2012-12-04 |
Conference closing time | 2012-12-07 |
Name of author (Chinese) | Song-Mao Wu |
Name of author (English) | Song-Mao Wu |
Authors | Ting-Han Chien(簡廷翰), Wen-Yi Ruan(阮文逸), Lung-Shu Huang, Sung-Mao Wu*(吳松茂) and Wei-Chi Chen |
Number of authors | 5 |
Author's type | Corresponding Author |
Location | 高雄 |
Language used | English |