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| Year | 2012 |
|---|---|
| Paper type | 會議論文 |
| Paper level | 其他 |
| Paper title (chapter) | Manufacture of Novel Double-Side Direct Thru Kit with Non-exchange Layer Structure Base on General PCB Process |
| Name of conference | Asia-Pacific Microwave Conference 2012 (APMC2012) |
| Conference starting time | 2012-12-04 |
| Conference closing time | 2012-12-07 |
| Name of author (Chinese) | Song-Mao Wu |
| Name of author (English) | Song-Mao Wu |
| Authors | Ting-Han Chien(簡廷翰), Wen-Yi Ruan(阮文逸), Lung-Shu Huang, Sung-Mao Wu*(吳松茂) and Wei-Chi Chen |
| Number of authors | 5 |
| Author's type | Corresponding Author |
| Location | 高雄 |
| Language used | English |
