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Seminar paper
Year2013
Paper type會議論文
Paper levelEI
Paper title (chapter)Using for Three-Dimensional Broadband Double-side Direct Thru Kit with Non-exchange Layer Design and analysis
Name of conferenceInternational Conference on Electronics Packaging
Conference starting time2013-04-10
Conference closing time2013-04-12
Name of author (Chinese)Song-Mao Wu
Name of author (English)Song-Mao Wu
AuthorsWen Yi Ruan(阮文逸), Ting-Han Chien(簡廷翰), Lung-Shu Huang(黃榮書) and Sung-Mao Wu*(吳松茂)
Number of authors4
Author's typeCorresponding Author
LocationOsaka, Japan
Language usedEnglish

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