:::
Seminar paper
Year2013
Paper type會議論文
Paper levelEI
Paper title (chapter)Using for Three-Dimensional Broadband Double-side Direct Thru Kit with Non-exchange Layer Design and analysis
Name of conferenceInternational Conference on Electronics Packaging
Conference starting time2013-04-10
Conference closing time2013-04-12
Name of author (Chinese)Song-Mao Wu
Name of author (English)Song-Mao Wu
AuthorsWen Yi Ruan(阮文逸), Ting-Han Chien(簡廷翰), Lung-Shu Huang(黃榮書) and Sung-Mao Wu*(吳松茂)
Number of authors4
Author's typeCorresponding Author
LocationOsaka, Japan
Language usedEnglish

Calendar

« December 2019»
Mon.Tue.Wed.Thu.Fri.Sat.Sun.
      01
02030405060708
09101112131415
16171819202122
23242526272829
3031
Decorative image

Decorative image

Decorative image

Gallery

Decorative imageDecorative imageDecorative imageDecorative imageDecorative imageDecorative imageDecorative imageDecorative imageDecorative imageDecorative imageDecorative imageDecorative image
Read more
cron web_use_log