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Seminar paper
Year2013
Paper type會議論文
Paper levelSCI
Paper title (chapter)Using Electromagnetic Band-gap Structure to eliminate frequency multiplication Noise and Implement 3D Band-pass filter on Testing Load Board
Name of conferenceInternational Conference on Electronics Packaging,
Conference starting time2013-04-10
Conference closing time2013-04-12
Name of author (Chinese)Song-Mao Wu
Name of author (English)Song-Mao Wu
AuthorsGuan-Min Wang(王冠閔), Yu-Chi Kuo(郭育齊), Wen-Te Chien(簡雯德) and Sung-Mao Wu*(吳松茂)
Number of authors4
Author's typeCorresponding Author
LocationOsaka, Japan
Language usedEnglish

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