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| Year | 2010 |
|---|---|
| Paper type | 會議論文 / 其他 |
| Paper level | SCI |
| Paper title (chapter) | Modeling and Co-Design of Novel Packaging Interposer with IPD Layers |
| Name of conference | International Conference on Solid State Devices and Materials (SSDM) |
| Conference starting time | 2010-09-22 |
| Conference closing time | 2010-09-24 |
| Name of author (Chinese) | Song-Mao Wu |
| Name of author (English) | Song-Mao Wu |
| Authors | Sung-Mao Wu, Ting-Yao Wu(吳庭耀), Bo-Huie Yu(余柏輝) and Chen-Chao Wang |
| Number of authors | 4 |
| Author's type | First Author / Corresponding Author |
| Location | Tokyo, Japan |
| Language used | English |
