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Seminar paper
Year2010
Paper type會議論文 / 其他
Paper levelSCI
Paper title (chapter)Modeling and Co-Design of Novel Packaging Interposer with IPD Layers
Name of conferenceInternational Conference on Solid State Devices and Materials (SSDM)
Conference starting time2010-09-22
Conference closing time2010-09-24
Name of author (Chinese)Song-Mao Wu
Name of author (English)Song-Mao Wu
AuthorsSung-Mao Wu, Ting-Yao Wu(吳庭耀), Bo-Huie Yu(余柏輝) and Chen-Chao Wang
Number of authors4
Author's typeFirst Author / Corresponding Author
LocationTokyo, Japan
Language usedEnglish

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