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Seminar paper
Year2010
Paper type會議論文
Paper levelSCI
Paper title (chapter)Co-Design and Modeling of Novel Packaging Interposer with IPD Layers
Name of conference2010 Asia-Pacific Microwave Conference (APMC)
Conference starting time2010-12-07
Conference closing time2010-12-10
Name of author (Chinese)Song-Mao Wu
Name of author (English)Song-Mao Wu
AuthorsSung-Mao Wu, Ting-Yao Wu(吳庭耀), Bo-Huie Yu(余柏輝), Cheng-Fu Yang and Chen-Chao Wang
Number of authors5
Author's typeFirst Author
LocationYokohama, Japan
Language usedEnglish

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