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Year | 2010 |
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Paper type | 會議論文 |
Paper level | SCI |
Paper title (chapter) | Co-Design and Modeling of Novel Packaging Interposer with IPD Layers |
Name of conference | 2010 Asia-Pacific Microwave Conference (APMC) |
Conference starting time | 2010-12-07 |
Conference closing time | 2010-12-10 |
Name of author (Chinese) | Song-Mao Wu |
Name of author (English) | Song-Mao Wu |
Authors | Sung-Mao Wu, Ting-Yao Wu(吳庭耀), Bo-Huie Yu(余柏輝), Cheng-Fu Yang and Chen-Chao Wang |
Number of authors | 5 |
Author's type | First Author |
Location | Yokohama, Japan |
Language used | English |