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Seminar paper
Year2009
Paper type會議論文 / 其他
Paper levelSCI
Paper title (chapter)EMI Reducing Solution by Modify EBG Structure for Stacked Packaging
Name of conferenceIEEE Electronics Packaging Technology Conference
Conference starting time2009-12-09
Conference closing time2009-12-11
Name of author (Chinese)Song-Mao Wu
Name of author (English)Song-Mao Wu
AuthorsSung-Mao Wu, Fung-Cheng Zhang(張豐程), Kuan-Wen Cheng(陳冠文)
Number of authors3
Author's typeFirst Author
LocationSingapore
Language usedEnglish

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