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Seminar paper
Year2009
Paper type會議論文 / 其他
Paper levelSCI
Paper title (chapter)Effect of Electromagnetic Band-gap Depredation by Plating Through Hold in Packaging Application
Name of conferenceIEEE Electronics Packaging Technology Conference
Conference starting time2009-12-07
Conference closing time2009-12-10
Name of author (Chinese)Song-Mao Wu
Name of author (English)Song-Mao Wu
AuthorsYung-Hsiang Chuang(莊詠翔), Sung-Mao WU
Number of authors2
Author's typeCorresponding Author
LocationSingapore
Language usedEnglish

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