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Year | 2008 |
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Paper type | 會議論文 / 其他 |
Paper level | SCI |
Paper title (chapter) | Frequency dielectric constant and loss tangent extracting of organic material using multi-length Microstrip |
Name of conference | IEEE Electronic Packaging Technology & High Density Packaging International Conference |
Conference starting time | 2008-07-28 |
Conference closing time | 2008-07-31 |
Name of author (Chinese) | Song-Mao Wu |
Name of author (English) | Song-Mao Wu |
Authors | Sung-Mao Wu, and Chi-Chang Lai, et al |
Number of authors | 3 |
Author's type | Corresponding Author |
Location | Shanghai, China |
Language used | English |