:::
| Year | 2007 |
|---|---|
| Paper type | 會議論文 / 其他 |
| Paper level | SCI |
| Paper title (chapter) | Embedded Process Development of Passive Component and Characterization Analysis for Organic Packaging Substrate |
| Name of conference | IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC) |
| Conference starting time | 2007-12-20 |
| Conference closing time | 2007-12-22 |
| Name of author (Chinese) | Song-Mao Wu |
| Name of author (English) | Song-Mao Wu |
| Authors | Sung-Mao Wu, Endruw Jahja ,Zhi-Zhang Lai, Yu-Che Dai and Jui-Wen Wang |
| Number of authors | 5 |
| Author's type | First Author |
| Language used | English |
