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Seminar paper
Year2007
Paper type會議論文 / 其他
Paper levelSCI
Paper title (chapter)Embedded Process Development of Passive Component and Characterization Analysis for Organic Packaging Substrate
Name of conferenceIEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC)
Conference starting time2007-12-20
Conference closing time2007-12-22
Name of author (Chinese)Song-Mao Wu
Name of author (English)Song-Mao Wu
AuthorsSung-Mao Wu, Endruw Jahja ,Zhi-Zhang Lai, Yu-Che Dai and Jui-Wen Wang
Number of authors5
Author's typeFirst Author
Language usedEnglish

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