出版日期:2015-04-00
期刊等級:SCI
論文名稱(篇名):The Impact of Junction Doping Distribution on Device Performance Variability and Reliability for Fully Depleted Silicon on Insulator with Thin BOX Layer MOSFETs
期刊名:IEEE Transactions on Nanotechnology
卷數:14
期數:2
起頁:1536
迄頁:1550
作者中文名:葉文冠
作者英文名:Wen-Kuan Yeh
全部作者:Wen-Kuan Yeh, Cheng-Li Lin, Tung-Huan Chou, Kehuey Wu, Jiann-Shiun Yuan
著作人數:5
作者型態:First Author