"Relationship between wafer fracture reduction and controlling during the edge manufacturing process" , Microelectronic Engineering , 87 , 10 , pp1809-1815 ,2010, (SCI)

  • 出版日期：2010-10-00
  • 期刊等級：SCI
  • 論文名稱(篇名)：Relationship between wafer fracture reduction and controlling during the edge manufacturing process
  • 期刊名：Relationship between wafer fracture reduction and controlling during the edge manufacturing process
  • 卷數：87
  • 期數：10
  • 起頁：1809
  • 迄頁：1815
  • 總頁數：6
  • 作者中文名：葉文冠
  • 作者英文名：Wen-Kuan Yeh
  • 全部作者：Po-Ying Chen, Ming-Hsing Tsai, Wen-Kuan Yeh, Ming-Haw Jing, and Yukon Chang
  • 著作人數：5
  • 作者型態：Other
  • 使用語言：英文