"Electrical Performance Improvements on RFICs Using Bump Chip Carrier Packages as Compared to Standard Thin Shrink Small Outline Packages" , IEEE TRANSACTIONS ON ADVANCED PACKAGING , 24 , 4 , pp548-554 ,2001, (SCI)

  • 出版日期：2001-11-00
  • 期刊等級：SCI
  • 論文名稱(篇名)：Electrical Performance Improvements on RFICs Using Bump Chip Carrier Packages as Compared to Standard Thin Shrink Small Outline Packages
  • 期刊名：IEEE TRANSACTIONS ON ADVANCED PACKAGING
  • 卷數：24
  • 期數：4
  • 起頁：548
  • 迄頁：554
  • 總頁數：7
  • 作者中文名：吳松茂
  • 作者英文名：Song-Mao Wu
  • 全部作者：Tzyy-Sheng Horng, Sung-Mao Wu, Chi-Tsung Chiu, and Chih-Pin Hung
  • 著作人數：4
  • 作者型態：Corresponding Author
  • 使用語言：英文