Print - "Embedded Process Development of Passive Component and Characterization Analysis for Organic Packaging Substrate",IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC),Tainan, Taiwan,2007/12/20-2007/12/22 (SCI)

"Embedded Process Development of Passive Component and Characterization Analysis for Organic Packaging Substrate",IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC),Tainan, Taiwan,2007/12/20-2007/12/22 (SCI)

年度：2007

論文類型：會議論文 / 其他

論文等級：SCI

論文名稱(篇名)：Embedded Process Development of Passive Component and Characterization Analysis for Organic Packaging Substrate

會議名稱：IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC)

會議開始時間：2007-12-20

會議結束時間：2007-12-22

作者中文名：吳松茂

作者英文名：Song-Mao Wu

全部作者：Sung-Mao Wu, Endruw Jahja ,Zhi-Zhang Lai, Yu-Che Dai and Jui-Wen Wang

著作人數：5

作者型態：First Author

會議地點：Tainan, Taiwan

使用語言：英文