計畫名稱：IC測試探針效能失效之原因探討與資料庫建立
執行起迄：2014/06/01~2015/05/31
總核定金額：558,000元
中文摘要：本計畫主要是執行“IC 測試探針效能失效之原因探討與資料庫建立”。探針失效之原因包含探針無法抓取可連結到 IC 信號之錫球、探針電性無法符合要求、探針磨損過快、探針表面鍍層剝離及探針沾黏不同金屬使探針電性飄移等。所以此計畫主要架構將分為三個部分來互相整合而達到分析探針效能失效之原因： 1. 佳倢科技有限公司-現今公司皆以探針外型及成本做為考量，為了使成本降低與管理的便利性，將整合各個不同 pitch 的針，將每個 pitch 盡量控制在三種外型，使其 housing 有相當的共用性利用設計新爪型。而佳倢科技有限公司將建議設計三種不同規格(pitch 0.4mm, 0.5mm, 0.8mm)來做為設計探針卡之考量。另外，該公司也將利用硬金屬鍍膜在探針表面鍍不同硬金屬來增加探針之耐磨性。 2. 吳松茂教授-為了確認新架構及硬鍍膜之探針電特性可行，不同 pitch 、爪型及不同硬金屬鍍膜探針電性確認測試，而測試之頻率至少要 10GHz；而為了加速測試探針之耐磨性，將設計新的測試夾具，此夾具具有較高之摩擦力，可進行加速研磨之作用，而研磨之探針需完成 5 次、20 次及 100 次之研磨實驗。 3. 楊證富教授-為了觀察探針之磨損與沾黏情況，所以利用電子顯微鏡來對探針的表面與橫斷面進行觀察，以了解探針爪型探針是否變型、針頭最前端磨損觀察，硬金屬鍍膜是否脫落；並且對碳針進行是否有表面沾黏觀察、沾黏物質 EDS 分析及表面鍍層觀察與 EDS 分析。最後歸納多次測試之結果，並將使用有限元素軟體 ABAQUS 來模擬晶圓針測的過程，並且建立 IC 測試探針效能失效之原因之資料庫。
英文摘要：This main purpose of this project will construct “The reason finding and database construction of failure in the IC testing probe”. The reasons lead to the fail detection of probes include that the probe cannot catch the tin balls, the electrical properties of probes cannot match the requirements, the rate of probes’ wear is too fast, the coatings of probes’ surface split, and the surfaces of probes are been stick with the different metals to cause the changes of electrical properties. For that, this project will composite three different research fields to find the reason and construct database for failure in the IC testing probe： 1. For JG Microtech CO., LTD- The pitch of the used probes will be controlled in three different structures, that will make housing with the common function to design the probe with sharp claws. JG Microtech CO., LTD will suggest the probes with three different pitch (0.4mm, 0.5mm, 0.8mm) for the consideration to design probe sockets. Also, the different hard-coat metals will be coated on the surfaces of the probes to impeove the rate of probes’ wear. 2. Prof. Wu- .In order to increase the rate of probes’ wear, Prof. Wu will design a new fixture. This fixture will have higher wae force and accelerate the test rate of probes’ wear. The test times of probes’ wear will carry out five, twenty, and fifty times, respectively. 3. Prof. Yang- The SEM’s observation is used to realize the claw structure of probes being changed or not, the rate of wear at the probes’ tip, and the hard-coat metals splitting out or not. Also, the observations of metals’ being stick or not and the energy dispersive spectrometer analysis (EDS) of stick metals are investigated by SEM. Finally, we will sum up the test results and use finite element software “ABAQUS” to simulate the procedure of probes’ test, and then we will construct the database for the fail’s reason of IC test probes.