Print - "Three-dimensional stacking miniaturization and high frequency of resonant ring," 2019 Electrical Design of Advanced Packaging and Systems (EDAPS), 2019, pp. 1-3.

"Three-dimensional stacking miniaturization and high frequency of resonant ring," 2019 Electrical Design of Advanced Packaging and Systems (EDAPS), 2019, pp. 1-3.

H. -W. Chen(陳昊暐), C. -J. Lee(李祈叡) and S. -M. Wu(吳松茂), "Three-dimensional stacking miniaturization and high frequency of resonant ring," 2019 Electrical Design of Advanced Packaging and Systems (EDAPS), 2019, pp. 1-3.