"Modeling Noise Coupling Between Package and PCB Power/Ground Planes With an Efficient 2-D FDTD/Lumped element Method" , IEEE Tran. On Advanced Packaging , vol.30 , no.4 , pp1-8 ,2007, (SCI),(其他)
出版日期：2007-11-00
期刊等級：SCI / 其他
論文名稱(篇名)：Modeling Noise Coupling Between Package and PCB Power/Ground Planes With an Efficient 2-D FDTD/Lumped element Method
期刊名：IEEE Tran. On Advanced Packaging
卷數：vol.30
期數：no.4
起頁：1
迄頁：8
總頁數：8
作者中文名：吳松茂
作者英文名：Song-Mao Wu
全部作者：Ting-Kuang Wang, Sin-Ting Chen, Chi-Wei Tsai, Sung-Mao Wu, James L. Drewniak, and Tzong-Lin Wu
