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"Impact of Fin Width and Back Bias Under Hot Carrier Injection on Double-Gate FinFETs" , IEEE Transaction on Device and Materials Reliability , 12 , 3 , pp1-4 ,2015, (SCI)

  • 出版日期:2015-06-00
  • 期刊等級:SCI
  • 論文名稱(篇名):Impact of Fin Width and Back Bias Under Hot Carrier Injection on Double-Gate FinFETs
  • 期刊名:IEEE Transaction on Device and Materials Reliability
  • 卷數:12
  • 期數:3
  • 起頁:1
  • 迄頁:4
  • 作者中文名:葉文冠
  • 作者英文名:Wen-Kuan Yeh
  • 全部作者:Wen-Teng Chang, Li-Gong Cin, Wen-Kuan Yeh
  • 著作人數:3
  • 作者型態:Corresponding Author
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