"The Impact of Junction Doping Distribution on Device Performance Variability and Reliability for Fully Depleted Silicon on Insulator with Thin BOX Layer MOSFETs" , IEEE Transactions on Nanotechnology , 14 , 2 , pp1536-1550 ,2015, (SCI)

出版日期：2015-04-00

期刊等級：SCI

論文名稱(篇名)：The Impact of Junction Doping Distribution on Device Performance Variability and Reliability for Fully Depleted Silicon on Insulator with Thin BOX Layer MOSFETs

期刊名：IEEE Transactions on Nanotechnology

卷數：14

期數：2

起頁：1536

迄頁：1550

作者中文名：葉文冠

作者英文名：Wen-Kuan Yeh

全部作者：Wen-Kuan Yeh, Cheng-Li Lin, Tung-Huan Chou, Kehuey Wu, Jiann-Shiun Yuan

著作人數：5

作者型態：First Author

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