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105學年度:電磁場型偵測探頭高效能微型化封裝設計實現

計畫名稱:電磁場型偵測探頭高效能微型化封裝設計實現
執行起迄:2016/06/01~2017/05/31
總核定金額:350,000元
中文摘要:本計畫的主要目標為針對具光電轉換特性之高效能電磁場型偵測探頭,設計與實現一可進行雷射對位、VCSEL 耦光及接收天線阻抗匹配之微型化封裝架構,並進行封裝後效能驗證及可靠性分析。計畫中被封裝之電路主要應用於結合一般探頭及光學探頭兩種設計的優點,可同時提供良好靈敏度且確保量測電場大小與相位的電磁場型偵測探頭電路,該電磁場型偵測探頭組成包含:接收電場的天線、提供運作電源的太陽能板元件以及將電訊號轉換成光訊號的垂直共腔面發射雷射元件(vertical cavity surface emitting laser, VCSEL)。
英文摘要:The main objective of this project is to design and implementation packaging structure with a laser can be performed on the bit, VCSEL coupled to the light and the receiving antenna impedance matching. The encapsulated effectiveness validation and reliability analysis for this packaging circuit will be check in this project. EM-field detecting probe be packaged is mainly used in combining the advantages of the package of general probes and optical probe two designs, can provide good sensitivity, can provide good sensitivity, ensures measuring electric field magnitude and phase of the electromagnetic field type detection probe circuit at the same time, the composition of the electromagnetic field type detection probe comprising: receiving an electric field antenna, solar panels provide operating power components and the electrical signal into an optical signal of a vertical cavity surface emitting laser element common (vertical cavity surface emitting laser, VCSEL).
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