105學年度：應用電磁交變訊號耦合之新型非接觸式系統電路測試技術研究
計畫名稱：應用電磁交變訊號耦合之新型非接觸式系統電路測試技術研究
執行起迄：2016/08/01~2017/08/31
總核定金額：660,000元
中文摘要：基於積體電路後端測試面臨之製程、材料、應力及電性種種相關問題，審視計畫主持人實驗室目前已掌握非接觸式線圈訊號單株阻抗匹配理論、線圈電磁模型建立技術及雙面量測校正治具研發之豐富經驗，以及依據研究技術背景所發展電磁模型訊號還原理論推導之初步結果，提出：線圈置入後端測試治具socket中，並搭配電磁交變耦合技術及已完成之電磁模型還原理論，對其進行分析驗證與研究探討，形成與實現一可支援積體電路測試之非接觸式量測及訊號傳遞系統，以及先進構裝雙面量測之新式校正治具開發，達成一完整之積體電路構裝層級之量測介面及平台初步建立。計畫主要研究方向包含： 1.藉由前期完成之線圈電磁模型還原理論，持續朝理論完整及實務驗證上發展，完成新式非接觸式系統電路量測技術。並研究可取代半導體後端測試重要組件-彈簧針(Spring Pins)之非接觸式訊號傳遞結構。 2.以非破壞性非接觸式訊號饋入形式，完成三維雙面直接校正穿透-線治具發展與實測，建立先進構裝製程之三維雙面校正程序與量測平台建立。
英文摘要：In this research, design of a high directivity coil and restore theory of signal radiation during coil and device under testing will be developed by non-contact signal transfer modeling and double-side direct calibration. Form and achieve a non-contact measurement and signal transduction systems support the integrated circuit testing. According to this achievement, a novel structure of double-side thru/line calibration kit with signal transduction by radiation will be provide and develop in this research. Directions of this research project include: 1. With the reduction theory of electromagnetic coil model development, a novel non-contact signal transmission structure to replace the key element of semiconductor backend test– Spring pin will be provided and developed. 2. Provide double-side direct calibration thru/line kit with non-contacting theorem, and develop a complete three-dimensional two-sided measurement platform.
執行起迄：2016/08/01~2017/08/31
總核定金額：660,000元
中文摘要：基於積體電路後端測試面臨之製程、材料、應力及電性種種相關問題，審視計畫主持人實驗室目前已掌握非接觸式線圈訊號單株阻抗匹配理論、線圈電磁模型建立技術及雙面量測校正治具研發之豐富經驗，以及依據研究技術背景所發展電磁模型訊號還原理論推導之初步結果，提出：線圈置入後端測試治具socket中，並搭配電磁交變耦合技術及已完成之電磁模型還原理論，對其進行分析驗證與研究探討，形成與實現一可支援積體電路測試之非接觸式量測及訊號傳遞系統，以及先進構裝雙面量測之新式校正治具開發，達成一完整之積體電路構裝層級之量測介面及平台初步建立。計畫主要研究方向包含： 1.藉由前期完成之線圈電磁模型還原理論，持續朝理論完整及實務驗證上發展，完成新式非接觸式系統電路量測技術。並研究可取代半導體後端測試重要組件-彈簧針(Spring Pins)之非接觸式訊號傳遞結構。 2.以非破壞性非接觸式訊號饋入形式，完成三維雙面直接校正穿透-線治具發展與實測，建立先進構裝製程之三維雙面校正程序與量測平台建立。
英文摘要：In this research, design of a high directivity coil and restore theory of signal radiation during coil and device under testing will be developed by non-contact signal transfer modeling and double-side direct calibration. Form and achieve a non-contact measurement and signal transduction systems support the integrated circuit testing. According to this achievement, a novel structure of double-side thru/line calibration kit with signal transduction by radiation will be provide and develop in this research. Directions of this research project include: 1. With the reduction theory of electromagnetic coil model development, a novel non-contact signal transmission structure to replace the key element of semiconductor backend test– Spring pin will be provided and developed. 2. Provide double-side direct calibration thru/line kit with non-contacting theorem, and develop a complete three-dimensional two-sided measurement platform.
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