100學年度：積體電路多晶片堆疊構裝系統之訊號整合與電磁干擾研究
計畫名稱：積體電路多晶片堆疊構裝系統之訊號整合與電磁干擾研究
執行起迄：2011/08/01~2012/07/31
總核定金額：626,000元
中文摘要：自系統級封裝被提出以來，產業界日益重視這樣議題，使用範圍亦日漸廣泛。由於系統級封裝的結構上較為複雜，導致設計整體電性效應分析需要較久的電磁模擬資源，使得在設計時程上花費相當多的時間。 本研究透過分析基板走線的長短、thermo ground ball的有無以及封裝接地環的有無，對封裝基板傳輸效應進行評估；並利用實驗室先前所建立出來的Package IP進行合成，建立封裝基板的模型，由此驗證Package IP的可行性。接著於本論文中將整合式被動元件進行封裝，並針對封裝與晶片之間的互相干擾進行分析與討論，最後提出完整的封裝等效電路模型。
英文摘要：Since the system-level package is proposed, the industry increasingly attach importance to such issues, the scope of its use is also becoming more widely. More complex system-level package structure, leading to the design of overall electrical effect require more electromagnetic simulation resources, so spend a lot of time in the design process. In this research, the transmission effects of substrate are analyzed by changing the length of the substrate transmission line, with or without thermo ground ball and the ground ring. Package IP previously established are synthesized to establish the model of the package substrate, which verifies the feasibility of the Package IP. Then this paper analysis the characteristics of the interference between chips and package by package the IPD, and propose the complete package equivalent circuit model.
執行起迄：2011/08/01~2012/07/31
總核定金額：626,000元
中文摘要：自系統級封裝被提出以來，產業界日益重視這樣議題，使用範圍亦日漸廣泛。由於系統級封裝的結構上較為複雜，導致設計整體電性效應分析需要較久的電磁模擬資源，使得在設計時程上花費相當多的時間。 本研究透過分析基板走線的長短、thermo ground ball的有無以及封裝接地環的有無，對封裝基板傳輸效應進行評估；並利用實驗室先前所建立出來的Package IP進行合成，建立封裝基板的模型，由此驗證Package IP的可行性。接著於本論文中將整合式被動元件進行封裝，並針對封裝與晶片之間的互相干擾進行分析與討論，最後提出完整的封裝等效電路模型。
英文摘要：Since the system-level package is proposed, the industry increasingly attach importance to such issues, the scope of its use is also becoming more widely. More complex system-level package structure, leading to the design of overall electrical effect require more electromagnetic simulation resources, so spend a lot of time in the design process. In this research, the transmission effects of substrate are analyzed by changing the length of the substrate transmission line, with or without thermo ground ball and the ground ring. Package IP previously established are synthesized to establish the model of the package substrate, which verifies the feasibility of the Package IP. Then this paper analysis the characteristics of the interference between chips and package by package the IPD, and propose the complete package equivalent circuit model.
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