"Impact of SOI Thickness on FUSI-Gate CESL CMOS Performance and Reliability" , IEEE Transactions on Device and Materials Reliability , 11 , 1 , pp44-49 ,2011, (SCI),(EI)

出版日期：2011-03-00

期刊等級：SCI / EI

論文名稱(篇名)：Impact of SOI Thickness on FUSI-Gate CESL CMOS Performance and Reliability

期刊名：IEEE Transactions on Device and Materials Reliability

卷數：11

期數：1

起頁：44

迄頁：49

總頁數：6

作者中文名：葉文冠

作者英文名：Wen-Kuan Yeh

全部作者：Yu-Ting Chen, K.-M. Chen, Wen-Kuan Yeh, C.-C. Wang, C-L. Lin, J.-S. Yuan, and F.-S. Yeh

著作人數：7

作者型態：Other

參考網址：http://ieeexplore.ieee.org/search/freesrchabstract.jsp?tp=&arnumber=5560782&queryText%3DImpact+of+SOI+Thickness+on+FUSI-Gate+CESL+CMOS+Performance+and+Reliability%26openedRefinements%3D*%26searchField%3DSearch+All

使用語言：英文

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