"Electrical Performance Improvements on RFICs Using Bump Chip Carrier Packages as Compared to Standard Thin Shrink Small Outline Packages" , IEEE TRANSACTIONS ON ADVANCED PACKAGING , 24 , 4 , pp548-554 ,2001, (SCI)
出版日期：2001-11-00
期刊等級：SCI
論文名稱(篇名)：Electrical Performance Improvements on RFICs Using Bump Chip Carrier Packages as Compared to Standard Thin Shrink Small Outline Packages
期刊名：IEEE TRANSACTIONS ON ADVANCED PACKAGING
卷數：24
期數：4
起頁：548
迄頁：554
總頁數：7
作者中文名：吳松茂
作者英文名：Song-Mao Wu
全部作者：Tzyy-Sheng Horng, Sung-Mao Wu, Chi-Tsung Chiu, and Chih-Pin Hung
