"Relationship between wafer fracture reduction and controlling during the edge manufacturing process" , Microelectronic Engineering , 87 , 10 , pp1809-1815 ,2010, (SCI)

出版日期：2010-10-00

期刊等級：SCI

論文名稱(篇名)：Relationship between wafer fracture reduction and controlling during the edge manufacturing process

期刊名：Relationship between wafer fracture reduction and controlling during the edge manufacturing process

卷數：87

期數：10

起頁：1809

迄頁：1815

總頁數：6

作者中文名：葉文冠

作者英文名：Wen-Kuan Yeh

全部作者：Po-Ying Chen, Ming-Hsing Tsai, Wen-Kuan Yeh, Ming-Haw Jing, and Yukon Chang

著作人數：5

作者型態：Other

使用語言：英文

Click Num: