吳松茂/研討會

日期	標題
2025-04-01	Validation of Broadband Extraction Methods for Material Electrical Parameters, (2024 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM)), 03 September 2024
2025-04-01	Signal Integrity Analysis Between Continuous Vias and Indirect Vias on RDL Circuits, (2024 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM)), 03 September 2024
2025-04-01	Electromagnetic Susceptibility of System Circuit Based on Near-Field Measurement Techniques, (2024 International Conference on Electronics Packaging (ICEP), 28 May 2024
2025-04-01	Research of Impedance Optimization with Mesh Reference Ground, (2024 International Conference on Electronics Packaging (ICEP), 28 May 2024
2025-04-01	Optimal Impedance Design for Meshed Ground Application at High-Speed Circuit, (2024 International Conference on Electronics Packaging (ICEP), 28 May 2024
2025-04-01	Design of Panel Level Package and Power and Signal Integrity Analysis (2024 International Conference on Electronics Packaging (ICEP), 28 May 2024
2025-04-01	A Novel High Electric Field EMS Probe for Automotive and Consumer System Levels, (2024 International Conference on Electronics Packaging (ICEP), 28 May 2024
2024-02-17	"Reserch of Unknown Noise Source in Package Power Distribution System", 2023 International Conference on Electronics Packaging (ICEP), 2023
2024-02-17	"Verification of Circuit Signal Detection Method for Non-contact Measurement System", 2023 International Conference on Electronics Packaging (ICEP), 2023
2022-03-11	"Switching Noise Analysis for Conducted Electromagnetic Interference from of Power Electronic Module," 2021 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC), 2021, pp. 1-4.