"Modeling and Co-Design of Novel Packaging Interposer with IPD Layers",International Conference on Solid State Devices and Materials (SSDM),Tokyo, Japan,2010/09/22-2010/09/24 (SCI)

年度：2010

論文類型：會議論文 / 其他

論文等級：SCI

論文名稱(篇名)：Modeling and Co-Design of Novel Packaging Interposer with IPD Layers

會議名稱：International Conference on Solid State Devices and Materials (SSDM)

會議開始時間：2010-09-22

會議結束時間：2010-09-24

作者中文名：吳松茂

作者英文名：Song-Mao Wu

全部作者：Sung-Mao Wu, Ting-Yao Wu(吳庭耀), Bo-Huie Yu(余柏輝) and Chen-Chao Wang

著作人數：4

作者型態：First Author / Corresponding Author

會議地點：Tokyo, Japan

使用語言：英文

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