"The high balance symmetric balun for WLAN and WiMAX application using the Integrated Passive Device (IPD) technology",Electronic Packaging Technology & High Density Packaging, (ICEPT-HDP 2009),Beijing, China,2009/08/10-2009/08/13 (SCI)

年度：2009

論文類型：會議論文

論文等級：SCI

論文名稱(篇名)：The high balance symmetric balun for WLAN and WiMAX application using the Integrated Passive Device (IPD) technology

會議名稱：Electronic Packaging Technology & High Density Packaging, (ICEPT-HDP 2009)

會議開始時間：2009-08-10

會議結束時間：2009-08-13

作者中文名：吳松茂

作者英文名：Song-Mao Wu

全部作者：Sung-Mao Wu; Wang-Yu Lin(林王昱); Kao-Yi Wang(王高義); Chien-Hsiang Huang; Wen-Kuan Yeh

著作人數：5

作者型態：First Author / Corresponding Author

會議地點：Beijing, China

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